Tuesday, September 01, 2015

ADAS Acronyms

As ADAS becomes a bigger and more important market for image sensor, Videantis publishes a list of ADAS-related acronyms helping you to navigate in the automotive world. Few examples of this new parlance showing how broad the car camera applications are:

  • ANV – Automotive Night Vision. Also known as Night View Assist.
  • APS – Automatic Parking System
  • BSD – Blind Spot Detection
  • BSM – Blind Spot Monitoring
  • BSW – Blind Spot Warning
  • BOP – Back-over Protection, Back-over Prevention
  • CIB – Crash Imminent Braking, Collision Imminent Braking
  • CDW – Collision Detection Warning
  • CAS – Collision Avoidance System
  • CMS – Camera Monitor System
  • CTA – Cross-Traffic Alert
  • DDW – Drowsy Driver Warning
  • DFW – Driver Fatigue Warning
  • DDD – Driver Drowsiness Detection
  • DMS – Driver Monitoring System
  • EDA – Emergency Driver Assistant
  • FCA – Forward Collision Avoidance
  • FCW – Forward Collision Warning
  • GFHB – Glare-free High Beam
  • HLA – Head Lamp Assist
  • ISA – Intelligent Speed Adaptation, Intelligent Speed Advice
  • LCA – Lane Change Assist, Lane Centering Assist
  • LD – Lane Detection
  • LDW – Lane Departure Warning
  • LKA – Lane Keeping Assist
  • RVC – Rear view camera
  • SVC – Surround View Camera
  • WWDA – Wrong-Way Driving Alert
  • WWDW – Wrong-Way Driving Warning

There are many more of them on Videantis site, accompanied by the nice explanations.

Monday, August 31, 2015

ULIS Pico384 Gen2 Promotional Video

ULIS publishes a Youtube promotional video of its Pico384 Gen2 thermal image sensor:

EVG Reports Strong Growth in Image Sensor Stacking Machinery

PRNewswire: EV Group (EVG) announces that the company is experiencing strong demand for its automated 300-mm polymer adhesive wafer bonding systems. Over the past 12 months, the company's order intake has doubled for these systems, including the EVG560, GEMINI and EVG850 TB/DB series of wafer bonders, includes multiple orders from foundries and outsourced semiconductor assembly and test providers headquartered in Asia. Much of the increase in demand is being fueled by advanced packaging manufacturers ramping up production of CMOS image sensors with TSV interconnects.


Intel Invests in Almalence

PRNewswire: Almalence announces that it has received an investment from Intel Capital. The funds will be used by Almalence to develop the next generation mobile imaging technology enabling mobile cameras to achieve the image quality level of DSLR cameras. Intel and Almalence have also entered into a strategic collaboration to bring Almalence's technology to Intel's architecture.

Almalence is a privately owned company with headquarters in Austin, Texas and the team distributed across the world - USA, Russia, Israel, China and South Korea. The company was founded in 2005 by Russian engineers Dmitry Shmunk and Eugene Panich, and has a track record of working with global mobile device manufacturers, such as Huawei and Sharp. Almalence's R&D activity is concentrated in Novosibirsk, Russia.

Eugene Panich, CEO of Almalence said: "Working with Intel will help us to enter a new stage in product development as we take the image quality of mobile cameras to new heights."

Arjun Kapur, Intel CVP, Platform Engineering Group, and GM, Imaging and Camera Technologies Group, said: "We look forward to working with Almalence to deliver such capabilities to the Intel mobile ecosystem."

Here is a Youtube video presenting Amalence Supersensor technology:

Saturday, August 29, 2015

Yole Interviews Sunex on ADAS Cameras

Yole Developpement publishes an interview with Peter Hark, Director of Automotive Sales and Marketing at Sunex. Few quotes:

"The low-end of [ADAS] market concerning rear view cameras is very mature and not very dynamic. The high-end is more about high resolution surround-view cameras from which images are stitched together to give a bird’s eye view of a car, i.e. for parking assist purposes. This area is enjoying high growth. Another growth area are forward-facing cameras which, due to new regulations (especially NCAP in Europe, but also in the U.S.), are being increasingly adopted.

At Sunex, we’ve developed what we call the NoGhost technology, which is able to reduce straylight effects. This has great value for HDR sensors. <...> Likewise thermally-compensated optics add value to computer vision applications such as forward sensing cameras where they can extend the operational temperature range.

Sunex Youtube video shows its NoGhost lens advantages:

Friday, August 28, 2015

IHS Sees Bright Future for Gesture Control

IHS publishes a nice infographics on gesture control market:

Yole Report on Camera Module Market

Yole Developpement publishes 2015 Camera Module Industry Report. The Compact Camera Module (CCM) market is forecasted to double in the next five years.

"Driven by mobile and automotive applications, the CCM industry is expected to grow at a CAGR of 16.8% from 2014 - 2020, reaching a total aggregate revenue of US$51B by 2020.

Automotive module revenue reached $1.2B in 2014, and growing at a CAGR of 36% should reach $7.9B by 2020. This exceptional growth has mainly benefited the CCM industry’s second-tier players, but the response of market leaders will be worth watching.

There is a different market trajectory for the lens and sensor markets, which are now maturing at ~14% CAGR with the emergence of giant billion-dollar companies. The CCM and auto-focus manufacturing markets, which are still very fragmented and growing at ~20% CAGR, should experience consolidation over the next five years.

The current CCM industry is controlled by Asian firms, mainly Korean and Japanese, but we’re also witnessing the rise of Chinese firms and the restructure of Taiwanese firms. An ongoing price war has leveled the market, and most players have operations in China or Vietnam.

IEEE Open Access Papers

IEEE Transactions on Electron Devices opens an early access to ON Semi paper "A 47 Million Pixel High-Performance Interline CCD Image Sensor" by Shen Wang, Douglas A. Carpenter, Adam DeJager, James A. DiBella, James E. Doran, Robert P. Fabinski, Andrew Garland, James A. Johnson, and Ryan Yaniga. The 47MP CCD is said to be "the world’s highest resolution interline-transfer CCD, has been developed for industrial, machine vision, and aerial photography applications. The sensor features a 5.5-┬Ám pixel, 16-output low-noise amplifier and a low-smear, fast-dump gate, horizontal lateral overflow drain, and on-chip temperature sensor. One challenge to manufacture this large sensor is stitching the sensor with different lithography tools, while still achieving equal or better image performance than its predecessor."

IEEE Journal on Solid-State Circuits publishes an open access paper "A Dynamic Vision Sensor With 1% Temporal Contrast Sensitivity and In-Pixel Asynchronous Delta Modulator for Event Encoding" by Yang, M., Liu, S.-C., and Delbruck, T., University of Zurich and ETH Zurich, Switzerland. "A dynamic vision sensor (DVS) encodes temporal contrast (TC) of light intensity into address-events that are asynchronously transmitted for subsequent processing. This paper describes a DVS with improved TC sensitivity and event encoding."

Thanks to DSSB for the links!

Hynix Prepares 13MP Mobile Sensor Samples

Hynix Q3 2015 catalog lists 13MP, 1.12um pixel sensor engineering samples planned for Q4 2015:

Tessera to Buy Ziptronix for $39M

BusinessWire: Tessera announces the acquisition of Ziptronix for $39 million in cash. Ziptronix’s patented ZiBond direct bonding and DBI hybrid bonding technologies have been licensed to Sony for volume production of its CMOS image sensors.

Dan Donabedian, President and CEO of Ziptronix says, “We’ve taken our technology from concept to commercialization in the backside illuminated image sensor and RF markets. Joining the Tessera family of companies combines our efforts with a proven leader in technology development and licensing in the semiconductor industry. This is a great alignment of companies that can address rapidly expanding 2.5D and 3D-IC markets.

The addition of the Ziptronix team will not change Tessera’s target operating expense structure. Tessera is making no adjustments to third quarter 2015 revenue or earnings per share guidance.