Sunday, December 28, 2014

Intel RealSense Cameras

Intel has shown its front and rear RealSense cameras in its IDF 2014 presentation:

As another Intel presentation from April 2014 tells, the company invests quite a lot into 3D vision development:

nanoLambda Spectrometer

In continuation to the previous post, JS commented that nanoLambda has a similar to Hamamatsu small size spectrometer. NanoLambda's presentation at last year's Trillion Sensors Summit gives some background about the company, its product and applications:

Saturday, December 27, 2014

Hamamatsu Predicts Rise of Consumer Spectrometers

Hamamatsu announces C12666MA, a new compact and cost-effective spectrometer for consumer applications:

The company says: "There is a trade-off relation between the spectrometer size and performance characteristics. As the size becomes smaller, the resolution deteriorates and the performance also declines. Our microspectrometer employs a method that diffracts the light after internally reflecting it one time, and is designed to exhibit the highest possible performance that achieves both satisfactory size and performance characteristics in this type of spectrometer."

"a further step forward was needed in both size and price in order to have them accepted for widespread use in the consumer electronics market... Small spectrometers can be built into compact devices. For example, we can expect to see new applications linked to smartphones or medical devices used at home."

The only company I've heard of working on consumer spectrometer products is Consumer Physics, completed its Kickstarter campaign in May 2014:

Friday, December 26, 2014

Andor Compares EMCCD and CMOS Cameras

As Rob pointed in comments, there is a nice Andor webinar comparing trade-offs in EMCCD and sCMOS camera design:

Thursday, December 25, 2014

Transparency Market Research Forecasts $43.06 Billion Camera Module Market in 2019

Transparency Market Research predicts that the global camera module market will grow from a net worth of nearly $12.00 billion in 2012 to $43.06 billion by the end of 2019, growing at a CAGR of nearly 19.7% between 2013 and 2019. Rising demands for CMOS camera modules and robust expansion of the market in Asia-Pacific countries such as India, China, Korea, Taiwan, and Singapore are supporting growth of the market.

The global camera module market is highly fragmented with market players competing hard to acquire significant market shares. Major businesses operating in the global camera modules’ marketplace include SEMCO, Liteon Chicony, Toshiba, STMicro, LG-Innotek, Primax, Sharp, Foxconn, Sunny, Samsung Fiberoptic, BYD, Vista Point, Cowell, Truly, and KMOT.

Wednesday, December 24, 2014

First Intel RealSense Products Go On Sale in Holland

Dutch PC Magazine reports that Netherlands is the first country where Intel RealSense 3D camera-equipped computers have become available on the market. Only two products featuring RealSense technology have reached the shops so far. Asus N551JQ Ultrabook offers the 3D camera as an option:

The second product is Lenovo B50-30 All-in-one PC, too offering RealSense camera and applications as an option.

The RealSense hardware has a visible camera, an IR camera, and a laser projector. The working distance is said to be 30-50cm.

Dutch site shows the first RealSense products and their camera:

Alexima Applies for GS Pixel with Tri-State Transfer Gate Patent

Alexima's patent application US20140367552 "Image sensors, methods, and pixels with tri-level biased transfer gates" by Jaroslav Hynecek and Alexander Krymski proposes a global shutter "pixel with a transfer gate that is controllable among at least three biasing conditions, including a first biasing condition in which electrons are transferable from a photodiode to a potential well under the transfer gate, a second biasing condition in which the electrons are confined in the potential well under the transfer gate, and a third biasing condition in which the electrons are transferable out of the potential well under the transfer gate." The pixel cross-section and its band diagram in all 3 modes is shown below:

Tuesday, December 23, 2014

Dual Aperture Raises $5.7M in Series A Funding

Dual Aperture International (DAI) has raised $5.7M in Series A funding led by Value Invest Korea (VIK), based in Seoul, South Korea. eWBM, a licensee of DAI’s technology, also participated in the round.

Cheol Lee, CEO of VIK says, “In the past few years, many companies have tried to enable low-cost and low-power 3-D image capture, depth estimation and gesture tracking. We think it’s time to approach the problem anew. We see Dual Aperture’s technology as a game changer and with the engineering resources and world class engineers of CISS, we see an opportunity for Dual Aperture International to disrupt the imaging business in mobile and beyond.

Dual Aperture's technology and alliances have been covered here, here and here.

Monday, December 22, 2014

Rice University Develops Atomic-Thin CCD

Rice University: Sidong Lei, a graduate student in the Rice lab of materials scientist Pulickel Ajayan, synthesized a single-layer matrix of copper, indium and selenium atoms (CIS). Lei also built a prototype three-pixel CCD to prove the material’s ability to capture an image:

The device traps electrons formed when light hits the material and holds them until released for storage, Lei said. CIS pixels are highly sensitive to light because the trapped electrons dissipate so slowly, said Robert Vajtai, a senior faculty fellow in Rice’s Department of Materials Science and NanoEngineering. “There are many two-dimensional materials that can sense light, but none are as efficient as this material,” he said. “This material is 10 times more efficient than the best we’ve seen before.

No info on the new sensor's QE is given, however article states that the sensor is transparent.

Manufacturing process starts with few-layer exfoliated CIS on a silicon substrate, ten fabricates three pairs of titanium/gold electrodes on top of the CIS and then cuts the CIS into three sections with a focused ion beam.

Sony Pregius Presentation

Spectronet posted a presentation "Sony Pregius sensors: A quantum leap for machine vision cameras" by Horst Mattfeldt, Matrix Vision GmbH. Most of it is devoted to the first generation 5.8um pixel IMX174 sensor:

There is also Vimeo video version in German.